Thermal conductivity of a polymide film between 4.2 and 300 K, with and without alumina particles as filler /

Thermal conductivity of a polymide film between 4.2 and 300 K, with and without alumina particles as filler /

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Bibliographic Details
Main Author: Rule, D. L
Corporate Author: National Institute of Standards and Technology (U.S.)
Other Authors: Smith, D. R, Sparks, Larry L
Format: Government Document Book
Language:English
Published: Boulder, Colo. : [Springfield, VA : U.S. Dept. of Commerce, National Institute of Standards and Technology ; Order from National Technical Information Service, 1990]
Series:NISTIR ; 3948
NISTIR ; 3948
Subjects:
Aluminum oxide > Thermal properties
Polyimides > Thermal properties
Description
Item Description:Distributed to depository libraries in microfiche
"August 1990."
Physical Description:ix, 66 p. : ill. ; 28 cm
Bibliography:Includes bibliographical references (p. 65-66)

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