Thermal conductivity of a polymide film between 4.2 and 300 K, with and without alumina particles as filler /

Bibliographic Details
Main Author: Rule, D. L
Corporate Author: National Institute of Standards and Technology (U.S.)
Other Authors: Smith, D. R, Sparks, Larry L
Format: Government Document Book
Language:English
Published: Boulder, Colo. : [Springfield, VA : U.S. Dept. of Commerce, National Institute of Standards and Technology ; Order from National Technical Information Service, 1990]
Series:NISTIR ; 3948
NISTIR ; 3948
Subjects:

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