Chemical mechanical polishing [videorecording] : meeting planarization requirements in ULSI manufacturing /

Chemical mechanical polishing [videorecording] : meeting planarization requirements in ULSI manufacturing /

Dale L. Hetherington of Scandia National Laboratories discusses the current status of CMP technology and projects future development trends

Bibliographic Details
Corporate Author: Massachusetts Institute of Technology Microsystems Technology Laboratories
Other Authors: Hetherington, Dale L
Format: Unknown
Language:English
Published: [Cambridge, Mass.] : MIT Microsystems Technology Laboratories, c1996
Series:MTL VLSI seminar
Subjects:
Grinding and polishing
Integrated circuits > Very large scale integration > Design and construction
Microelectronics > Materials
Microelectronics
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Massachusetts Institute of Technology

Holdings details from Massachusetts Institute of Technology
Call Number: VIDEO TK7874.75.M37 1996-17

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