Modeling and simulation for microelectronic packaging assembly : manufacture, reliability, and testing /

Modeling and simulation for microelectronic packaging assembly : manufacture, reliability, and testing /

"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation."--

Bibliographic Details
Main Author: Liu, S (Sheng), 1963-
Corporate Authors: Hazel M. Hussong Fund, Wiley InterScience (Online service)
Other Authors: Liu, Yong, 1962-
Format: Book
Language:English
Published: Hoboken, N.J. : Wiley, 2011
Hoboken, N.J. : 2011
Subjects:
Microelectronic packaging > Simulation methods
Microelectronic packaging
Simulation methods
TECHNOLOGY & ENGINEERING > Electronics > Circuits > General

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Stanford University

Holdings details from Stanford University
Call Number: INTERNET RESOURCE

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