Modeling and simulation for microelectronic packaging assembly : manufacture, reliability, and testing /
"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation."--
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Format: | Book |
Language: | English |
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Hoboken, N.J. :
Wiley,
2011
Hoboken, N.J. : 2011 |
Subjects: |
Internet
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