Characterization of integrated circuit packaging materials

Market opportunities have driven a dramatic increase in the functionality of integrated circuits (ICs), placing greater demands on the performance and reliability of the IC package

Bibliographic Details
Other Authors:	McKenna, Robert G, Moore, Thomas M
Format:	Electronic Book
Language:	English
Published:	[New York, N.Y.] (222 East 46th Street, New York, NY 10017) : Momentum Press, 2010
Edition:	1st ed
Series:	Materials characterization series
Subjects:	Electronic packaging > Materials Integrated circuits > Design and construction > ^A1029049 Reliability testing adhesion chemical composition determination delamination die mounting electrical characteristics hermeticity mechanical stress microstructure solderability surface and thin film analysis thermal characteristics