Characterization of integrated circuit packaging materials
Market opportunities have driven a dramatic increase in the functionality of integrated circuits (ICs), placing greater demands on the performance and reliability of the IC package
Other Authors: | , |
---|---|
Format: | Electronic Book |
Language: | English |
Published: |
[New York, N.Y.] (222 East 46th Street, New York, NY 10017) :
Momentum Press,
2010
|
Edition: | 1st ed |
Series: | Materials characterization series
|
Subjects: |
Internet
This item is not available through BorrowDirect. Please contact your institution’s interlibrary loan office for further assistance.Stanford University
Call Number: |
INTERNET RESOURCE |
---|