Characterization of integrated circuit packaging materials
Market opportunities have driven a dramatic increase in the functionality of integrated circuits (ICs), placing greater demands on the performance and reliability of the IC package
| Other Authors: | , |
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| Format: | Electronic Book |
| Language: | English |
| Published: |
[New York, N.Y.] (222 East 46th Street, New York, NY 10017) :
Momentum Press,
2010
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| Edition: | 1st ed |
| Series: | Materials characterization series
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| Subjects: |
Internet
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