Interface Strength Evaluation of LSI Devices Using the Weibull Stress /

Interface Strength Evaluation of LSI Devices Using the Weibull Stress /

Interface fracture strength is evaluated by the Weibull stress criterion for LSI devices composed of epoxy resin and Fe-Ni alloy sheet. The difference in coefficient of thermal expansion of the epoxy resin and Fe-Ni sheet causes a stress singularity at the corner ends of the device in the cooling pr...

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Bibliographic Details
Main Authors: Minami, F. (Author), Nakamura, T. (Author), Takahara, W. (Author)
Corporate Authors: Predictive Material Modeling: Combining Fundamental Physics Understanding, Computational Methods and Empirically Observed Behavior Dallas, Texas, ASTM International, American Society for Testing and Materials
Format: Conference Proceeding Book
Language:English
Published: West Conshohocken, Pa. : ASTM International, 2004
Subjects:
Delamination
Dissimilar material joints
Interface strength
LSI devices
Local approach
Package geometry
Steel > Metallurgy > Congresses
Steel > Metallurgy
Weibull stress

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