Thermal conductivity of a polymide film between 4.2 and 300 K, with and without alumina particles as filler /

Bibliographic Details
Main Author: Rule, D. L
Corporate Authors: National Engineering Laboratory (U.S.) Chemical Engineering Science Division, Superconducting Super Collider Laboratory
Other Authors: Smith, D. R, Sparks, Larry L
Format: Government Document Book
Language:English
Published: Boulder, Colo. : [Springfield, VA] : Chemical Engineering Science Division, Center for Chemical Engineering, National Measurement Laboratory, National Institute of Standards and Technology ; [Available from National Technical Information Service], [1990]
Series:NISTIR ; 3948
Subjects:

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