Designing with hybrid microelectronic circuits : symposium record /

Designing with hybrid microelectronic circuits : symposium record /

Bibliographic Details
Corporate Authors: IEEE Parts, Materials, and Packaging Group, Symposium on Designing With Hybrid Microelectronic Circuits, Western Electronic Show and Convention
Format: Conference Proceeding Book
Language:English
Published: [Los Angeles] : Western Electronic Show and Convention, 1968
Subjects:
Hybrid integrated circuits > Congresses
Microelectronics > Congresses
Hybrid integrated circuits
Conference papers and proceedings

Internet

This item is not available through BorrowDirect. Please contact your institution’s interlibrary loan office for further assistance.

Massachusetts Institute of Technology

Holdings details from Massachusetts Institute of Technology
Call Number: TK7874.D4

Similar Items