2019 Joint International Symposium on e-Manufacturing and Design Collaboration (eMDC) & Semiconductor Manufacturing (ISSM) : proceedings of technical papers : September 6, 2019, HsinChu, Taiwan /

Bibliographic Details
Corporate Authors:	e-Manufacturing & Design Collaboration Symposium Hsinchu City, Taiwan, IEEE Electron Devices Society (sponsoring body), Institute of Electrical and Electronics Engineers (sponsoring body), International Symposium on Semiconductor Manufacturing
Other Authors:	Tsai, Yu-chu (Editor)
Format:	Conference Proceeding Book
Language:	English
Published:	Chutung, Hsinchu, Taiwan : Taiwan Semiconductor Industry Association (TSIA), [2019]
Subjects:	Computer integrated manufacturing systems > Congresses Engineering design > Congresses Manufacturing processes > Data processing > Congresses Production engineering > Data processing > Congresses Semiconductors > Design and construction > Congresses Computer integrated manufacturing systems Engineering design Manufacturing processes > Data processing Production engineering > Data processing Semiconductors > Design and construction Conference papers and proceedings > ^A3291746 Conference papers and proceedings

Description
Item Description:	"IEEE Catalog Number: 19SSM-CDR"--PDF copyright page
Physical Description:	1 online resource : illustrations (some color)
Bibliography:	Includes bibliographical references and author index

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